Our Line Card

SiTime offers the broadest portfolio of MEMS timing products in the industry

Precision Super-TCXOs
Low Jitter Oscillators
High Temperature Oscillators
Programmable spread-spectrum oscillators

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RF & Microwave power amplifier modules & systems that incorporate GaN, LDMOS, MOSFET, GaAsFET device technologies.

RF Power Amplifier modules up to 6GHZ.
Multifunction high Power systems with embedded software.
Custom designed RF Power amplifiers.
Broadband and band-specific solid state power amplifiers up to 2500W.

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Espressif offers the world's most integrated, reliable and energy efficient WiFi & BLE SOCs and Modules.

WiFi SOCs and Modules
WiFi & BLE combo SOC and Modules
Open source IOT App

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A leading developer of low-power, HD and Ultra HD video compression and image processing solutions

4K Ultra HD SoC for IP Cameras
Consumer and professional IP Camera SoC
Smart security IP cameras SoC
Surveillance Ultra HD Camera SoC

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Sony GPS/GNSS ultra-low power Receiver ICs

Lowest power consumption GNSS Chips only 6mW/9mW
Highest precision for accurate positioning
Compatible with L1 and L5 bands
Compact footprint smaller than 10 mm2
Single or dual band options

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Nisshinbo Micro Devices - a leading semiconductor company resulting from the integration of Ricoh Electronic Devices and NJRC (New Japan Radio Co., Ltd.).

Electronic Devices
RF Devices

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Ambarella based low power image processing SoMs.

Oclea XR - SoM based on the Ambarella CV2 SoC for low-power AI applications.
Oclea MX8 - (SoM) based on Ambarella CV22 SoC for high-performance AI applications.
Oclea Vision Toolkit

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Reliable and secure storage for embedded systems and datacenters

NANDrive™ ball grid array (BGA) solid state drive (SSD)
ArmourDrive™ SSD
PCIe Flash Card
NAND Controller
Specialty NOR Flash Memory

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Aldetec, Incorporated is a provider of custom Integrated Microwave Assemblies (IMAs) and RF & MW Amplifiers up to 30GHZ.

Broadband RF Power Amplifiers
Low Noise RF Amplifiers
Limiting Amplifiers
Up/Down Converters

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Commercial & Military Grade RF & MW Filters up to 25 GHZ

Bandpass, highpass & lowpass filter
Switched Filter Banks
Tunable Filters
Multiplexers

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RF Semiconductors, Opto couplers, laser diodes

RF Switches and Ultra Low Noise GaAs FETs
Opto Couplers & SSRs
Laser Diodes & Laser Dies
2.4GHZ Tread & ZigBee Modules

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High precision crystal oscillators, VCXO, TCXO, OCXO, Stratum 3, timing ICs

Network synchronization Timing ICs
Sync card, line card and clock distribution ICs
Low phase noise and low Jitter OCXOs
Stratum 3 and Stratum 3E oscillators

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The leading global developer of ISM Band/ SRD FM low power radio modules.

ISM Transmitters, Receivers, Transceivers & RF Modems
Single-channel and Multi-Channel operation
Radio Packet Modems
FCC Part 90 Compliant, FCC Part 15 compliant

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GLF is focusing on Ultra Low Power Solutions on Power Protection and Saving.

Integrated Power Load Switch
Current Limit Power Switch
Power Deep Sleep Protection
Power Reset Protection
Battery Protection
Automotive IC's
Power Mux with Two Inputs and Single Output

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Specializes in cost-effective, next-gen integrated semiconductor components for 5G wireless infrastructure.

Sub 6GHZ high efficiency Power MMICs
5G RF Front End MMICs
5G Gain amplifiers
Beamforming ICs

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Cologne Chip FPGAs made in Germany Incorporates open-source design tools alongside Cologne Chip's proprietary, free-of-charge Place & Route tool.

High-Performance, Low-Cost FPGAs made in Germany.
High logic capacity with multi-die capability and low power footprint.
Open-source and proprietary design tools for easy adoption.

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Highly efficient and easy to program ultra-low-power RISC-V processors. They interpret and transform rich data sources such as images, sounds and radar signals using AI and signal processing.

GAP8 enables embedded machine learning in battery-operated IoT Sensors.
GAP9 combines ultra-low latency filtering with DSP and NN acceleration to power the next generation of hearables and IoT devices.

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Empower’s patented IVR technology eliminates dozens of discrete components by using a single IC with greater efficiency and 10x reduction in PCB area.